2UUL BG02 Universal Reballing Stencil AB
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2UUL BG02 Universal Reballing Stencil AB.
Rs 1,600
2UUL BG02 Universal Reballing Stencil AB. • Aligns the ball array to the pads in one pass • Cut for specific chip footprints • Steel construction that stays…
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2UUL BG02 Universal Reballing Stencil AB.
Key features
- Aligns the ball array to the pads in one pass
- Cut for specific chip footprints
- Steel construction that stays flat under hot air
What this is used for
- Reballing a chip after removal
- Rebuilding a ball array
- Middle-layer and CPU reballing
Who it's for
Micro-soldering technicians reballing chips.
Where it fits in the repair
Clean the old solder off and level the pads, seat the chip, lay the stencil over it, squeegee paste across the openings, reflow, then lift the stencil once the balls have set.
Manufacturer description
2UUL BG02 Universal Reballing Stencil AB. • Aligns the ball array to the pads in one pass • Cut for specific chip footprints • Steel construction that stays flat under hot air Compatible with: BGA reballing work — confirm the footprints covered with us before ordering.
Repair guides for this tool
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