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iPhone logic boards from the 8 generation onward are two boards soldered face to face through an interposer ball array. When one layer is destroyed, the surviving layer can be paired with a CNC-machined donor — milled clean of old solder and flat, ready to reball.
Order the opposite half to whichever layer survived on the customer board. You will also need the middle-layer reballing stencil for that model plus paste, flux and hot air — the CNC board removes the cleaning-up stage, not the reballing.
It is a prepared donor board layer. When one half of a stacked iPhone board is damaged beyond repair, you keep the good half and rejoin it to a CNC-milled donor rather than scrapping the phone.
Yes. The two layers rejoin through an interposer ball array, so the middle-layer stencil for that model is required. The CNC board only saves you milling the donor clean yourself.
It is specialist. It needs hot air with fine control, a middle-layer stencil, magnification and practice. Shops that do it well treat stacked-board repair as its own discipline.