
A CNC-machined lower board layer for the iPhone 13 and iPhone 13 Mini.
A CNC-machined lower board layer for the iPhone 13 and iPhone 13 Mini. • Machined lower layer for the iPhone 13 and iPhone 13 Mini • Milled flat and clean,…
A CNC-machined lower board layer for the iPhone 13 and iPhone 13 Mini.
Board-level specialists doing stacked-board reconstruction.
Split the customer board, recover the good layer, clean and level both mating faces, reball the interposer array through a middle-layer stencil, align the CNC donor and reflow.
A CNC-machined lower board layer for the iPhone 13 and iPhone 13 Mini. • Machined lower layer for the iPhone 13 and iPhone 13 Mini • Milled flat and clean, ready to reball • Saves a customer board where only one layer is dead Compatible with: iPhone 13 and iPhone 13 Mini logic board.
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