Amaoe LCD 3 V9.0 High-Precision BGA Reballing Stencil

Key features

• Laser-cut square micro-aperture matrix at 0.12mm thickness
• Prevents solder paste overflow and keeps solder ball height uniform
• Heat-resistant stainless steel that resists warping under hot air
• Single multi-functional plate spanning many iPhone generations

What this is used for

• Transferring display ICs to clear "Important Display Message" warnings
• Repairing unresponsive touch layers
• Re-soldering Face ID dot projectors and infrared arrays

Who it's for

Microsoldering technicians doing display IC and Face ID board work. Reballing assumes hot air and microscope experience.

Where it fits in the repair

IC removal → pad cleaning → stencil alignment → solder paste and reballing → IC reinstallation → test.

Manufacturer description

A reballing stencil decides whether your solder balls come out uniform or uneven, and this Amaoe plate is cut for the display-side ICs that most screen and Face ID faults trace back to. Its square micro-aperture matrix is laser-cut at 0.12mm, thin enough to stop solder paste overflowing the pads and consistent enough to give even ball height across the array. One plate covers an unusually wide generation range — iPhone 6S through iPhone 17 Pro Max — which is why it tends to replace several single-model stencils on a working bench. The steel matters under a hot air gun. Heat-resistant stainless holds its shape at rework temperatures instead of warping or flexing, which is the failure that ruins a tin-planting job halfway through. • Laser-cut square micro-aperture matrix at 0.12mm thickness • Prevents solder paste overflow and keeps solder ball height uniform • Heat-resistant stainless steel that resists warping under hot air • Single multi-functional plate spanning many iPhone generations Compatible with: iPhone 6S through iPhone 17 Pro Max.