Hong Hai Tong G7 Special CPU Glue Cutting Blade No. 5 (Hook/Scraping Blade)

Key features

• Profile ground for underfill and hardened glue
• Directs force into the glue rather than across the board
• Consumable — change the edge before it starts needing pressure

What this is used for

• Removing underfill from around a CPU
• Clearing glue before chip removal
• Pad cleaning

Who it's for

Micro-soldering technicians removing underfilled chips.

Manufacturer description

Hong Hai Tong G7 Special CPU Glue Cutting Blade No. 5 (Hook/Scraping Blade) Removing hard underfill and cured glue from delicate logic boards is one of the highest-risk tasks in mobile repair. Standard utility blades often skid under pressure, risking catastrophic damage to the surrounding micro-components. The Hong Hai Tong G7 No. 5 Hook/Scraping Blade is specifically engineered to eliminate that risk. Its custom-ground profile safely and mechanically parts hardened glue by directing force directly into the adhesive itself, rather than scraping across the delicate surface of the PCB. This gives you absolute control over the separation process. **Key Features:** * **Precision-Ground Profile:** Custom-shaped specifically for splitting tough underfill and hardened CPU glue without damaging the chip. * **Anti-Skid Design:** Directs force downward into the glue, preventing dangerous slips into nearby fragile board components. * **Specialized Hook/Scraping Tip:** Ideal for meticulous scraping, lifting, and detailed cleaning around BGA ICs. * **Professional Grade:** An essential precision tool for advanced micro-soldering, mobile logic board, and CPU repair tasks. (Note: This is a precision consumable tool. For optimal safety and performance, always replace the blade before it dulls to ensure you never have to apply excessive pressure.)