LB F20 MAX MIDDLE LAYER 11-17

Key features

• Covers iPhone 11 through 17 middle layers
• Stencils and holding jig supplied together as a system
• Repeatable ball placement on stacked boards

What this is used for

• Reballing the stacked-board middle layer
• Separating and rejoining board layers
• Board-level repair on layered iPhone boards

Who it's for

Micro-soldering technicians splitting and rejoining stacked iPhone boards.

Where it fits in the repair

Split the board halves, clean and level the pads, seat the lower half in the jig, lay the matching stencil over it, squeegee paste across the openings, reflow, then lift the stencil once the balls have set.

Manufacturer description

A middle-layer reballing kit covering iPhone 11 through 17 — the stencils plus the jig that holds board and stencil square. iPhone boards from the 8 onward are stacked: two boards soldered face to face through an interposer ball array. Splitting them for repair means reballing that interface before they go back together, and freehand alignment at that pitch is where arrays drift. Buying stencils and jig as a set matters because they are a system. A stencil without a fixture to hold it flat smears paste underneath itself, and that is what gives an uneven array. • Covers iPhone 11 through 17 middle layers • Stencils and holding jig supplied together as a system • Repeatable ball placement on stacked boards Compatible with: iPhone 11 through iPhone 17 logic boards.