
A reballing board at BGA 210, sized 14 × 15mm, for WiFi IC work.
A reballing board at BGA 210, sized 14 × 15mm, for WiFi IC work. Match ball count and size to the chip.
A reballing board at BGA 210, sized 14 × 15mm, for WiFi IC work. Match ball count and size to the chip.
Reballing technicians.
A reballing board at BGA 210, sized 14 × 15mm, for WiFi IC work. Match ball count and size to the chip.
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