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HomeShopHeat Welding SeriesMIJING HC-05 50g 183°C High Purity Residue Free Solder Wire
Mijing HC-05 0.5mm rosin core solder wire 50g spool

MIJING HC-05 50g 183°C High Purity Residue Free Solder Wire

No reviews

The 0.5 mm wire in Mijing's HC range — the number in the name is the diameter — on a 50 g spool with a 183°C melting point and a rosin flux core.

Rs 600

The 0.5 mm wire in Mijing's HC range — the number in the name is the diameter — on a 50 g spool with a 183°C melting point and a rosin flux core. 0.5 mm is the…

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  • Nationwide delivery
    Same-day dispatch from Peshawar before 4 PM
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The 0.5 mm wire in Mijing's HC range — the number in the name is the diameter — on a 50 g spool with a 183°C melting point and a rosin flux core.

0.5 mm is the general-purpose diameter for phone repair. It delivers enough solder for connectors and jumpers without flooding a fine pad, which is why most benches keep this one as the default and reach for 0.3 mm only under the microscope.

Key features

  • 0.5 mm diameter — the general-purpose choice
  • 183°C eutectic melting point with rosin flux core
  • Low residue, 50 g spool

What this is used for

  • Connector soldering
  • Jumper wire attachment
  • General board repair

Who it's for

Repair technicians wanting a reliable everyday solder wire.

Manufacturer description

The 0.5 mm wire in Mijing's HC range — the number in the name is the diameter — on a 50 g spool with a 183°C melting point and a rosin flux core. 0.5 mm is the general-purpose diameter for phone repair. It delivers enough solder for connectors and jumpers without flooding a fine pad, which is why most benches keep this one as the default and reach for 0.3 mm only under the microscope. • 0.5 mm diameter — the general-purpose choice • 183°C eutectic melting point with rosin flux core • Low residue, 50 g spool Compatible with: Phone logic board soldering and general electronics work.

Repair guides for this tool

  • Buying guideHow to Choose a Soldering Station for Mobile Phone Repair
  • TutorialHow to Reball a BGA Chip: Step-by-Step Guide

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