
Rosin-core solder wire on a 50 g spool, in a 60/40 tin-lead composition with a 183°C melting point.
Rosin-core solder wire on a 50 g spool, in a 60/40 tin-lead composition with a 183°C melting point. The model number is simply the wire diameter: HC-03 is 0.3…
Rosin-core solder wire on a 50 g spool, in a 60/40 tin-lead composition with a 183°C melting point.
The model number is simply the wire diameter: HC-03 is 0.3 mm, HC-05 is 0.5 mm and HC-08 is 0.8 mm. That is the only choice you are making. Fine wire for board work under a microscope, thicker wire where you need to deliver more solder per pass.
Micro-soldering technicians choosing wire diameter by task.
Rosin-core solder wire on a 50 g spool, in a 60/40 tin-lead composition with a 183°C melting point. The model number is simply the wire diameter: HC-03 is 0.3 mm, HC-05 is 0.5 mm and HC-08 is 0.8 mm. That is the only choice you are making. Fine wire for board work under a microscope, thicker wire where you need to deliver more solder per pass. • Model number is the diameter — 0.3 mm, 0.5 mm or 0.8 mm • 183°C eutectic melting point, rosin core • 50 g spool Compatible with: Phone logic board soldering and general electronics work.
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