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HomeShopHeat Welding SeriesMIJING iRepair MS1 iPhone HOLLOW VERSION 11-17 Series Multi-Functional Intelligent Desoldering Preheating Station Kit
MIJING iRepair MS1 desoldering and preheating station kit with expansion plates for iPhone board separation

MIJING iRepair MS1 iPhone HOLLOW VERSION 11-17 Series Multi-Functional Intelligent Desoldering Preheating Station Kit

No reviews

Sandwich logic boards have to be split before either half can be worked on, and the whole risk of that job is heat reaching the ICs instead of the solder seam.

Rs 48,000

Sandwich logic boards have to be split before either half can be worked on, and the whole risk of that job is heat reaching the ICs instead of the solder seam.…

In stock — ships within 24 hours
Not sure it fits your repair? Ask a technician
  • Nationwide delivery
    Same-day dispatch from Peshawar before 4 PM
  • Authentic parts
    100% genuine, sourced from manufacturers
  • 7-day returns
    No-questions return on most items

Sandwich logic boards have to be split before either half can be worked on, and the whole risk of that job is heat reaching the ICs instead of the solder seam. The MS1 is a modular thermal base station built around controlling exactly that.

It runs from 50°C to 300°C with a rapid-heating element, real-time LED temperature tracking and a countdown safety timer, so the board reaches a known temperature for a known time rather than by feel.

The kit ships with a full set of CNC-machined synthetic stone and copper expansion plates, which is what extends one base station across the entire iPhone 11 to 17 range instead of tying it to a single generation.

Key features

  • Rapid-heating element with real-time LED temperature tracking
  • Integrated countdown safety timer
  • Uniform thermal profiles from 50°C to 300°C
  • CNC-machined synthetic stone and copper expansion plates included
  • Covers seven iPhone generations from one base station

What this is used for

  • Splitting sandwich logic boards
  • Middle-frame layer separation
  • Component desoldering with controlled preheat

Who it's for

Microsoldering technicians separating layered iPhone logic boards across multiple generations.

Where it fits in the repair

Board removal, seat on the matching expansion plate, controlled preheat to the target temperature, split or desolder, component repair, then reassemble and test.

Manufacturer description

Sandwich logic boards have to be split before either half can be worked on, and the whole risk of that job is heat reaching the ICs instead of the solder seam. The MS1 is a modular thermal base station built around controlling exactly that. It runs from 50°C to 300°C with a rapid-heating element, real-time LED temperature tracking and a countdown safety timer, so the board reaches a known temperature for a known time rather than by feel. The kit ships with a full set of CNC-machined synthetic stone and copper expansion plates, which is what extends one base station across the entire iPhone 11 to 17 range instead of tying it to a single generation. • Rapid-heating element with real-time LED temperature tracking • Integrated countdown safety timer • Uniform thermal profiles from 50°C to 300°C • CNC-machined synthetic stone and copper expansion plates included • Covers seven iPhone generations from one base station Compatible with: iPhone 11 series, iPhone 12 series, iPhone 13 series, iPhone 14 series, iPhone 15 series, iPhone 16 series, iPhone 17 series.

Repair guides for this tool

  • TutorialHow to Reball a BGA Chip: Step-by-Step Guide

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