
The MIJING R13 Adjustable IC Chip Degluing Work Platform is a precision repair fixture designed for mobile phone CPU, IC and BGA chip maintenance. Featuring an…
The MIJING R13 Adjustable IC Chip Degluing Work Platform is a precision repair fixture designed for mobile phone CPU, IC and BGA chip maintenance. Featuring an adjustable clamping structure, it helps keep compatible chips securely positioned during glue removal and related motherboard repair operations. Its anti-shift design supports stable component placement, allowing technicians to work with greater positioning control during delicate IC maintenance. A practical addition to professional mobile phone motherboard repair workshops. Key Features - Adjustable clamping design for compatible IC chips. - Anti-shift structure for improved component stability. - Suitable for CPU and BGA chip maintenance. - Designed for IC glue removal operations. - Supports accurate chip positioning. - Useful for professional motherboard repair work. Specifications Field Details Brand MIJING Model R13 Product Type Adjustable IC Degluing Work Platform Application CPU / IC / BGA Chip Repair Clamping Type Adjustable Anti-Shift Package 1 Piece
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