QUICK 2008 HOT AIR
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QUICK 2008 HOT AIR.
Rs 26,000
QUICK 2008 HOT AIR. Hot air is how you remove and refit anything with hidden joints — shields, connectors, BGA chips. What matters is airflow control as much…
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QUICK 2008 HOT AIR.
Hot air is how you remove and refit anything with hidden joints — shields, connectors, BGA chips. What matters is airflow control as much as temperature: too much flow blows small components off the board before the solder is even molten.
Set airflow low and temperature moderate, and give the board time. Chasing speed with high heat is what lifts pads and warps laminate.
Key features
- Airflow and temperature control for board rework
- For shields, connectors and BGA work
- Bench station for daily repair use
What this is used for
- Removing and refitting shields
- Chip removal and reflow
- Connector rework
Who it's for
Board-level repair technicians.
Manufacturer description
QUICK 2008 HOT AIR. Hot air is how you remove and refit anything with hidden joints — shields, connectors, BGA chips. What matters is airflow control as much as temperature: too much flow blows small components off the board before the solder is even molten. Set airflow low and temperature moderate, and give the board time. Chasing speed with high heat is what lifts pads and warps laminate. • Airflow and temperature control for board rework • For shields, connectors and BGA work • Bench station for daily repair use Compatible with: Phone logic board rework.