What is a stacked iPhone board?

From the iPhone 8 onward Apple solders two boards face to face through a ball array. Splitting them for repair means reballing that interface before they go back together — which is what these stencils are for.

Do four stencils really cover eight generations?

The A to D layouts cover the common interposer patterns across that range. Tell us the exact model you are working on and we will confirm before you order.

DEEPFIXQuality you love

2UUL BG01 ABCD Reballing Stencil for iPh 8-16PM (4pcs/pack)

Name: 2UUL BG01 ABCD Reballing Stencil for iPh 8-16PM (4pcs/pack)
Brand: 2UUL
SKU: 2UUL-BG01
Price: 2700 PKR
Availability: InStock

No reviews

A four-stencil pack — the A, B, C and D layouts — covering iPhone 8 through 16 Pro Max reballing work.

Rs 2,700

A four-stencil pack — the A, B, C and D layouts — covering iPhone 8 through 16 Pro Max reballing work. iPhone boards from the 8 onwards are stacked: two boards…

In stock — ships within 24 hours

Quantity

Not sure it fits your repair? Ask a technician

Nationwide delivery
Same-day dispatch from Peshawar before 4 PM
Authentic parts
100% genuine, sourced from manufacturers
7-day returns
No-questions return on most items

A four-stencil pack — the A, B, C and D layouts — covering iPhone 8 through 16 Pro Max reballing work.

iPhone boards from the 8 onwards are stacked: two boards soldered face to face through an interposer ball array. Reballing that interface is what these stencils are for, and having four layouts in one pack covers the generations without buying a stencil per model.

Key features

Four stencil layouts (A, B, C and D) in one pack
Covers iPhone 8 through 16 Pro Max
For stacked-board interposer reballing

What this is used for

Reballing the stacked-board interface
Separating and rejoining board layers
Board-level repair on layered iPhone logic boards

Who it's for

Micro-soldering technicians splitting and rejoining stacked iPhone boards.

Manufacturer description

A four-stencil pack — the A, B, C and D layouts — covering iPhone 8 through 16 Pro Max reballing work. iPhone boards from the 8 onwards are stacked: two boards soldered face to face through an interposer ball array. Reballing that interface is what these stencils are for, and having four layouts in one pack covers the generations without buying a stencil per model. • Four stencil layouts (A, B, C and D) in one pack • Covers iPhone 8 through 16 Pro Max • For stacked-board interposer reballing Compatible with: iPhone 8 through iPhone 16 Pro Max logic boards.