2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad

Key features

• Seats the chip square and level
• Lets the stencil lie flat for a clean squeegee pass
• Heat resistant through reflow

What this is used for

• Reballing a chip after removal
• Rebuilding a ball array
• Middle-layer and CPU reballing

Who it's for

Micro-soldering technicians reballing chips.

Where it fits in the repair

Clean the old solder off and level the pads, seat the chip, lay the stencil over it, squeegee paste across the openings, reflow, then lift the stencil once the balls have set.

Manufacturer description

2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad. A silicone buffer seats the chip square and level so the stencil above it lies flat. A stencil that rocks even slightly smears paste under itself, and that is what produces an uneven array. It also tolerates reflow heat, so it stays put through the operation rather than deforming under the hot air. • Seats the chip square and level • Lets the stencil lie flat for a clean squeegee pass • Heat resistant through reflow Compatible with: BGA reballing work — confirm the footprints covered with us before ordering.