
JOINT X solder paste, offered in 158°C, 183°C and 200°C melting points.
JOINT X solder paste, offered in 158°C, 183°C and 200°C melting points. Choose by what is around the joint. 183°C is the standard eutectic tin-lead grade for…
JOINT X solder paste, offered in 158°C, 183°C and 200°C melting points.
Choose by what is around the joint. 183°C is the standard eutectic tin-lead grade for everyday reballing; 158°C lets you work beside something you must not release; 200°C gives a joint that survives later rework nearby without flowing again.
Micro-soldering technicians who select paste temperature per job.
JOINT X solder paste, offered in 158°C, 183°C and 200°C melting points. Choose by what is around the joint. 183°C is the standard eutectic tin-lead grade for everyday reballing; 158°C lets you work beside something you must not release; 200°C gives a joint that survives later rework nearby without flowing again. • Three melting points: 158°C, 183°C and 200°C • For reballing, pad rework and component attachment • Squeegee grade for stencil work Compatible with: BGA reballing stencils and phone board rework.
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