2UUL JOINT X Solder Paste for Repair 158°C/183°C/200°C/ 50g
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The 50 g jar of JOINT X solder paste, in 158°C, 183°C or 200°C.
Rs 1,500
The 50 g jar of JOINT X solder paste, in 158°C, 183°C or 200°C. The larger jar is the sensible buy for a bench that reballs regularly — but only if you will…
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The 50 g jar of JOINT X solder paste, in 158°C, 183°C or 200°C.
The larger jar is the sensible buy for a bench that reballs regularly — but only if you will use it. Paste has a real shelf life, and a half-used jar that has been through many warm-cold cycles solders worse than fresh paste from a small one.
Key features
- 50 g jar for regular reballing work
- Three melting points: 158°C, 183°C and 200°C
- Squeegee grade for stencil work
What this is used for
- Regular reballing work
- Pad rework
- Component attachment before reflow
Who it's for
Repair shops reballing often enough to use a large jar.
Manufacturer description
The 50 g jar of JOINT X solder paste, in 158°C, 183°C or 200°C. The larger jar is the sensible buy for a bench that reballs regularly — but only if you will use it. Paste has a real shelf life, and a half-used jar that has been through many warm-cold cycles solders worse than fresh paste from a small one. • 50 g jar for regular reballing work • Three melting points: 158°C, 183°C and 200°C • Squeegee grade for stencil work Compatible with: BGA reballing stencils and phone board rework.
Repair guides for this tool
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