
Solder balls sized for rebuilding pads on phone logic boards during rework.
Solder balls sized for rebuilding pads on phone logic boards during rework. Placing a ball is how you restore a pad that has lost its bump, and how you re-bump…
Solder balls sized for rebuilding pads on phone logic boards during rework.
Placing a ball is how you restore a pad that has lost its bump, and how you re-bump a chip that has to go back. Consistent ball size is the whole specification — mixed sizes give an uneven array, and an uneven array means the chip sits at an angle and some joints never form.
Micro-soldering technicians doing pad-level rework.
Solder balls sized for rebuilding pads on phone logic boards during rework. Placing a ball is how you restore a pad that has lost its bump, and how you re-bump a chip that has to go back. Consistent ball size is the whole specification — mixed sizes give an uneven array, and an uneven array means the chip sits at an angle and some joints never form. • Consistent ball size for an even array • For iPhone and Android board pad rework • Rebuilds pads and re-bumps chips Compatible with: iPhone and Android logic board pad rework.
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