2UUL SC10 CPU Fever Paste for Cooling CPU After Repair

Key features

• Restores heat transfer from chip to shield
• Paste form — fills an irregular gap
• Prevents post-repair thermal throttling

What this is used for

• Replacing thermal material after board work
• Restoring heat transfer to a shield
• Fixing throttling that appeared after a repair

Who it's for

Technicians reassembling boards that use thermal interface material.

Manufacturer description

2UUL SC10 CPU Fever Paste for Cooling CPU After Repair. Thermal interface material bridges the air gap between a chip and the shield or frame above it. Air conducts heat poorly, so without it the heat simply stays in the chip. That is why leaving it out after a repair produces a phone that throttles or shuts down under load — a fault that appears after the repair rather than before it, and gets blamed on the repair. Correctly. • Restores heat transfer from chip to shield • Paste form — fills an irregular gap • Prevents post-repair thermal throttling Compatible with: Phone logic board chips and shields.