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HomeShopMIJING iSOCKETMijing C24 Pro Motherboard Layered Testing Fixture (iPhone 16 Series iSocket)
Mijing C24 Pro motherboard layered testing fixture with beryllium-copper probes for iPhone 16 series

Mijing C24 Pro Motherboard Layered Testing Fixture (iPhone 16 Series iSocket)

No reviews

The 16-series member of the Mijing layered-test family: a solder-free stand that holds a split top and bottom board together so the phone can be powered and tested before the layers are permanently rejoined.

Rs 45,000

The 16-series member of the Mijing layered-test family: a solder-free stand that holds a split top and bottom board together so the phone can be powered and…

In stock — ships within 24 hours
Not sure it fits your repair? Ask a technician
  • Nationwide delivery
    Same-day dispatch from Peshawar before 4 PM
  • Authentic parts
    100% genuine, sourced from manufacturers
  • 7-day returns
    No-questions return on most items

The 16-series member of the Mijing layered-test family: a solder-free stand that holds a split top and bottom board together so the phone can be powered and tested before the layers are permanently rejoined.

Its probes are spring-loaded hardened beryllium-copper alloy, a harder contact than the gold-plated probes on the earlier C21 and C23 fixtures, which matters across repeated test cycles.

Key features

  • Solder-free interconnect for split logic boards
  • Spring-loaded hardened beryllium-copper alloy probes
  • Full function testing before the middle layers are resoldered

What this is used for

  • Testing split logic boards before resoldering
  • Verifying display, touch, Face ID, signal and cameras

Who it's for

Microsoldering technicians doing layered board repair on the iPhone 16 series.

Manufacturer description

The 16-series member of the Mijing layered-test family: a solder-free stand that holds a split top and bottom board together so the phone can be powered and tested before the layers are permanently rejoined. Its probes are spring-loaded hardened beryllium-copper alloy, a harder contact than the gold-plated probes on the earlier C21 and C23 fixtures, which matters across repeated test cycles. • Solder-free interconnect for split logic boards • Spring-loaded hardened beryllium-copper alloy probes • Full function testing before the middle layers are resoldered Compatible with: iPhone 16, iPhone 16 Plus, iPhone 16 Pro, iPhone 16 Pro Max.

Repair guides for this tool

  • TutorialHow to Reball a BGA Chip: Step-by-Step Guide

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