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Test racks for stacked-board repair. iPhone boards from the 8 generation onward are two layers soldered face to face, and a test rack lets you power and test the layers before committing to rejoining them.
This is what stops you reballing a board twice. Testing before rejoining tells you whether the fault is actually fixed, and finding out afterwards means splitting and reballing the interposer array all over again.
Because rejoining means reballing the interposer array. If the fault is still present afterwards you have to split and reball the whole thing again — testing first avoids doing the hardest step twice.