Mijing C21 Pro Motherboard Layered Testing Fixture (iPhone 13 Series iSocket)

Key features

• Solder-free interconnect for split top and bottom logic boards
• Custom gold-plated spring probes
• High-precision CNC alignment machining
• Full function testing before the middle frames are resoldered

What this is used for

• Testing split logic boards before resoldering
• Verifying display, touch and camera function
• Checking Face ID, WiFi and baseband signal

Who it's for

Microsoldering technicians doing layered board repair on the iPhone 13 series.

Where it fits in the repair

Board separation, component repair, mount both halves in the C21 Pro, power and test every function, then resolder the middle frames once the board passes.

Manufacturer description

Splitting a sandwich logic board and soldering it back together before testing is how a repair turns into two repairs. The C21 Pro exists to close that gap: it clamps the separated top and bottom boards together temporarily so the phone can be powered and tested before anything is permanent. Contact is made through custom gold-plated spring probes on a CNC-machined alignment frame, so the interconnect is solder-free and repeatable. With the board live in the fixture you can verify display, touch, cameras, Face ID, WiFi and baseband signal — the functions most likely to reveal that the repair is not finished yet. • Solder-free interconnect for split top and bottom logic boards • Custom gold-plated spring probes • High-precision CNC alignment machining • Full function testing before the middle frames are resoldered Compatible with: iPhone 13, iPhone 13 Mini, iPhone 13 Pro, iPhone 13 Pro Max.