Tin Paste Series
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Solder pastes in a range of melting points — 138°C, 150°C, 183°C and higher — for reballing and component attachment.
How to choose Tin Paste Series
Choose melting point by what surrounds the joint. 183°C is standard eutectic tin-lead and the everyday default; lower temperatures let you reflow beside a component you must not disturb. Store paste refrigerated and bring it to room temperature before opening, because opening a cold jar condenses moisture into it.
Tin Paste Series frequently asked questions
Which melting point should I use?
183°C for everyday work — it is the eutectic point of 63/37 tin-lead, melting and freezing at a single temperature with no pasty stage. Lower temperatures are for working beside components you must not disturb.
How should I store solder paste?
Refrigerated and sealed, and always brought to room temperature before opening. Opening a cold jar condenses moisture straight into the paste.