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HomeShopTin Paste SeriesMIJING NEW 158°C Low Temperature Solder Paste
MIJING NEW 158°C low temperature solder paste

MIJING NEW 158°C Low Temperature Solder Paste

No reviews

A 158°C paste sitting between the 138°C and 183°C options — lower thermal stress than standard, with a more robust joint than the lowest grade.

Rs 1,200

A 158°C paste sitting between the 138°C and 183°C options — lower thermal stress than standard, with a more robust joint than the lowest grade.

In stock — ships within 24 hours
Not sure it fits your repair? Ask a technician
  • Nationwide delivery
    Same-day dispatch from Peshawar before 4 PM
  • Authentic parts
    100% genuine, sourced from manufacturers
  • 7-day returns
    No-questions return on most items

A 158°C paste sitting between the 138°C and 183°C options — lower thermal stress than standard, with a more robust joint than the lowest grade.

What this is used for

  • IC reballing
  • BGA chip repair

Who it's for

Micro-soldering technicians.

Manufacturer description

A 158°C paste sitting between the 138°C and 183°C options — lower thermal stress than standard, with a more robust joint than the lowest grade.

Repair guides for this tool

  • TutorialHow to Reball a BGA Chip: Step-by-Step Guide

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