MIJING MJ199 High-Purity Tin Paste – 199°C
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MIJING MJ199 High-Purity Tin Paste – 199°C.
Rs 1,200
MIJING MJ199 High-Purity Tin Paste – 199°C. Solder paste is powdered solder suspended in flux. You squeegee it through a stencil when reballing and place it…
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MIJING MJ199 High-Purity Tin Paste – 199°C.
Solder paste is powdered solder suspended in flux. You squeegee it through a stencil when reballing and place it under a component before reflow. This one melts at 199°C.
Key features
- 199°C melting point
- Powdered solder suspended in flux
- Squeegee grade for stencil work
What this is used for
- Reballing through a stencil
- Attaching components before reflow
- Pad rework
Who it's for
Micro-soldering technicians doing reballing and rework.
Manufacturer description
MIJING MJ199 High-Purity Tin Paste – 199°C. Solder paste is powdered solder suspended in flux. You squeegee it through a stencil when reballing and place it under a component before reflow. This one melts at 199°C. • 199°C melting point • Powdered solder suspended in flux • Squeegee grade for stencil work Compatible with: BGA reballing stencils and phone board rework.
Repair guides for this tool
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