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Accessories that support reballing work — platforms, magnetic pads, silicone buffers and stencil storage. "Tin planting" is the trade term for placing a fresh ball array on a chip.
A silicone buffer under the chip is a small purchase that decides the result: it seats the chip square so the stencil lies flat, and a stencil that rocks smears paste underneath itself.
It is the trade term for reballing — placing a fresh array of solder balls onto a chip so it can be refitted to a board.