MIJING Z23 Samsung S20 Ultra Middle-Layer BGA Reballing Platform

Key features

• 0.12 mm precision BGA stencil
• Magnetic positioning system holds chips flat
• Built for Samsung S20 Ultra mid-layer work
• Extends to other Samsung S-series with the right module

What this is used for

• Middle-layer BGA reballing
• Samsung board-level chip repair

Who it's for

Microsoldering technicians doing Samsung board-level work.

Manufacturer description

A magnetic positioning platform for Samsung Galaxy S20 Ultra middle-layer board repair — Samsung-specific tooling, which is comparatively rare against the iPhone-focused market. It pairs a 0.12mm precision BGA stencil with magnetic positioning to hold the chip flat for accurate solder-ball placement. It also works with other Samsung S-series boards depending on the positioning module used. • 0.12 mm precision BGA stencil • Magnetic positioning system holds chips flat • Built for Samsung S20 Ultra mid-layer work • Extends to other Samsung S-series with the right module Compatible with: Samsung Galaxy S20 Ultra, Other Samsung S-series (module dependent).