MIJING Multifunctional Chip Tin

Key features

• Stepped recesses suit a range of chip sizes
• Heat-resistant silicone that tolerates reflow temperatures
• Holds the chip square so the stencil sits flat

What this is used for

• Seating a chip square beneath a reballing stencil
• Reballing CPU and power management ICs

Who it's for

Micro-soldering technicians reballing BGA chips.

Where it fits in the repair

Drop the chip into the recess that matches its footprint, lay the reballing stencil on top so it sits flat, squeegee paste across the openings, then reflow.

Manufacturer description

A heat-resistant silicone pad that sits underneath a BGA reballing stencil, with stepped square recesses sized for different chip footprints. The pad is printed 多功能硅胶垫片 — multifunctional silicone gasket — and 配合芯片植锡网使用, meaning it is used together with a chip reballing stencil. It seats the chip square and level so the stencil lies flat on top, which is what keeps the ball array even. • Stepped recesses suit a range of chip sizes • Heat-resistant silicone that tolerates reflow temperatures • Holds the chip square so the stencil sits flat Compatible with: BGA reballing stencils and chips within the recess sizes.