Mijing Z21 Max CPU Universal BGA Reballing Stencil Platform Kit

Key features

• Dynamic magnetic positioning core clamps chips flat automatically
• Universal array of laser-cut square-holed steel stencils
• Covers Apple A8 through A18 Pro / A19 series
• Supports Snapdragon, Kirin and MediaTek chip formats

What this is used for

• CPU tin planting and reballing
• BGA chip reballing across Apple and Android platforms

Who it's for

Microsoldering technicians reballing CPUs across both Apple and Android platforms.

Where it fits in the repair

Chip removal, pad cleaning, seat the chip on the magnetic core, align the matching stencil, apply paste and reball, then reinstall and test.

Manufacturer description

Reballing a CPU depends on the chip sitting perfectly flat against the stencil. The Z21 Max handles that with a dynamic magnetic positioning core that automatically snaps and clamps micro-chips flat as the stencil comes down. The kit includes a universal array of laser-cut, square-holed steel meshes rather than a single plate, which is what gives it range. That range is unusually wide: Apple CPU architectures from A8 up to the A18 Pro / A19 series, covering iPhone X through the 16 and 17 series, plus major Android formats including Qualcomm Snapdragon, HiSilicon Kirin and MediaTek. • Dynamic magnetic positioning core clamps chips flat automatically • Universal array of laser-cut square-holed steel stencils • Covers Apple A8 through A18 Pro / A19 series • Supports Snapdragon, Kirin and MediaTek chip formats Compatible with: iPhone X through iPhone 16 / 17 series (A8 to A18 Pro / A19), Qualcomm Snapdragon devices, HiSilicon Kirin devices, MediaTek (MTK) devices.