Mijing M21 universal planting tin platform for IC reballing

Mijing M21 universal planting tin platform

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A universal tin planting platform giving stable, heat-resistant support for ICs during solder paste application and reballing.

Rs 3,000

A universal tin planting platform giving stable, heat-resistant support for ICs during solder paste application and reballing. Universal rather than…

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A universal tin planting platform giving stable, heat-resistant support for ICs during solder paste application and reballing.

Universal rather than chip-specific, so it covers a range of components with the appropriate stencil.

What this is used for

  • Solder paste application
  • IC reballing and rework

Who it's for

Microsoldering technicians doing reballing.

Manufacturer description

A universal tin planting platform giving stable, heat-resistant support for ICs during solder paste application and reballing. Universal rather than chip-specific, so it covers a range of components with the appropriate stencil.

Repair guides for this tool

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