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Reballing stencils, listed under their Chinese trade name. "Locate the planting tin net" is a literal rendering of 植锡网 — in English these are BGA reballing stencils, cut so a ball array lands on the pads without manual placement.
A stencil alone does not do the job. You also need something to hold the chip square underneath it, solder paste, flux and hot air with fine airflow control. A stencil that rocks while you squeegee smears paste and gives an uneven array — which is what makes a chip sit at an angle so some joints never form.
It is a direct translation of the Chinese 植锡网 — a BGA reballing stencil. Same product, more familiar name in English.
Solder paste, flux, hot air with fine airflow control, desoldering wick to clean and level the pads first, and a fixture to hold the chip flat under the stencil.