What does "mid-level network" mean?

It is a direct translation of the Chinese 中层网 — a middle-layer reballing stencil. In English these are usually called BGA reballing stencils or tin planting nets. Same product.

Which chips does the set cover?

It is cut for common chip footprints across Xiaomi boards. Tell us the exact board or chip you are reballing and we will confirm the set includes it before you order.

What else do I need to reball with it?

Solder paste, a hot air station with fine airflow control, flux, and something to hold the board flat. A silicone reballing pad under the stencil keeps the chip from shifting.

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Mijing Xiaomi series mid-layer network

Name: Mijing Xiaomi series mid-layer network
Brand: Mijing
SKU: MJ-XIAOMISERI
Price: 1100 PKR
Availability: InStock

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A Mijing BGA reballing stencil set covering Xiaomi logic boards.

Rs 1,100

A Mijing BGA reballing stencil set covering Xiaomi logic boards. Each stencil is cut for a specific chip footprint, so the ball array lands exactly on the pads…

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A Mijing BGA reballing stencil set covering Xiaomi logic boards. Each stencil is cut for a specific chip footprint, so the ball array lands exactly on the pads with no manual alignment.

Key features

Cut to specific Xiaomi chip footprints — no manual ball alignment
Covers CPU and middle-layer reballing
Steel construction that stays flat under hot air

What this is used for

Reballing a CPU or middle-layer BGA after removal
Rebuilding a ball array on a reclaimed chip
Repairing lifted or bridged pads under a BGA

Who it's for

Micro-soldering technicians doing chip-level work on Xiaomi boards.

Where it fits in the repair

Clean the old solder off the chip and level the pads, seat the chip in the stencil recess, squeegee solder paste across the openings, reflow with hot air, then lift the stencil once the balls have set.

Manufacturer description

A Mijing BGA reballing stencil set covering Xiaomi logic boards. Each stencil is cut for a specific chip footprint, so the ball array lands exactly on the pads with no manual alignment. • Cut to specific Xiaomi chip footprints — no manual ball alignment • Covers CPU and middle-layer reballing • Steel construction that stays flat under hot air Compatible with: Xiaomi series phone logic boards.