Which phones use the Kirin 970?

It is the HiSilicon SoC in the Huawei Mate 10 and P20 generations. Confirm the chip marking on your board before ordering, because a stencil cut for one footprint will not align on another.

Can I reball without a positioning stencil?

You can place balls by hand, but it is slow and the array drifts. A positioning stencil holds the chip square and puts every ball on its pad in one pass.

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Huawei Kirin 970 CPU Positioning BGA Reballing Stencil (HW-1)

Name: Huawei Kirin 970 CPU Positioning BGA Reballing Stencil (HW-1)
Brand: Mijing
SKU: DFX-HUAWEIKIRIN
Price: 1000 PKR
Availability: InStock

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The Mijing HW-1 positioning stencil, cut for the Huawei Kirin 970 CPU footprint.

Rs 1,000

The Mijing HW-1 positioning stencil, cut for the Huawei Kirin 970 CPU footprint. The recess holds the chip square while you squeegee paste across the openings,…

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The Mijing HW-1 positioning stencil, cut for the Huawei Kirin 970 CPU footprint.

The recess holds the chip square while you squeegee paste across the openings, so the ball array lands on the pads without any manual placement. That is the difference between a reball that reflows first time and one you chase for an hour.

Key features

Cut specifically for the Kirin 970 CPU footprint
Positioning recess holds the chip square during paste application
Steel construction that stays flat under hot air

What this is used for

Reballing a Kirin 970 CPU after removal
Rebuilding the ball array on a reclaimed chip
Repairing lifted pads under the CPU

Who it's for

Micro-soldering technicians doing CPU-level work on Huawei boards.

Where it fits in the repair

Clean the old solder off the chip and level the pads, seat the chip in the stencil recess, squeegee paste across the openings, reflow with hot air, then lift the stencil once the balls have set.

Manufacturer description

The Mijing HW-1 positioning stencil, cut for the Huawei Kirin 970 CPU footprint. The recess holds the chip square while you squeegee paste across the openings, so the ball array lands on the pads without any manual placement. That is the difference between a reball that reflows first time and one you chase for an hour. • Cut specifically for the Kirin 970 CPU footprint • Positioning recess holds the chip square during paste application • Steel construction that stays flat under hot air Compatible with: Huawei boards using the HiSilicon Kirin 970 (including Mate 10 and P20 series).