What does "mid-level network" mean?

It is a direct translation of the Chinese 中层网 — a middle-layer reballing stencil. In English these are usually called BGA reballing stencils or tin planting nets. Same product.

Which chips does the set cover?

It is cut for common chip footprints across Xiaomi Mi boards. Tell us the exact board or chip you are reballing and we will confirm the set includes it before you order.

What else do I need to reball with it?

Solder paste, a hot air station with fine airflow control, flux, and something to hold the board flat. A silicone reballing pad under the stencil keeps the chip from shifting.

DEEPFIXQuality you love

Mijing MI series Locate the planting tin net

Name: Mijing MI series Locate the planting tin net
Brand: Mijing
SKU: MJ-FRG
Price: 1000 PKR
Availability: InStock

No reviews

A Mijing BGA reballing stencil set covering Xiaomi Mi logic boards.

Rs 1,000

A Mijing BGA reballing stencil set covering Xiaomi Mi logic boards. Each stencil is cut for a specific chip footprint, so the ball array lands exactly on the…

In stock — ships within 24 hours

Quantity

Not sure it fits your repair? Ask a technician

Nationwide delivery
Same-day dispatch from Peshawar before 4 PM
Authentic parts
100% genuine, sourced from manufacturers
7-day returns
No-questions return on most items

A Mijing BGA reballing stencil set covering Xiaomi Mi logic boards. Each stencil is cut for a specific chip footprint, so the ball array lands exactly on the pads with no manual alignment.

Key features

Cut to specific Xiaomi Mi chip footprints — no manual ball alignment
Covers CPU and middle-layer reballing
Steel construction that stays flat under hot air

What this is used for

Reballing a CPU or middle-layer BGA after removal
Rebuilding a ball array on a reclaimed chip
Repairing lifted or bridged pads under a BGA

Who it's for

Micro-soldering technicians doing chip-level work on Xiaomi Mi boards.

Where it fits in the repair

Clean the old solder off the chip and level the pads, seat the chip in the stencil recess, squeegee solder paste across the openings, reflow with hot air, then lift the stencil once the balls have set.

Manufacturer description

A Mijing BGA reballing stencil set covering Xiaomi Mi logic boards. Each stencil is cut for a specific chip footprint, so the ball array lands exactly on the pads with no manual alignment. • Cut to specific Xiaomi Mi chip footprints — no manual ball alignment • Covers CPU and middle-layer reballing • Steel construction that stays flat under hot air Compatible with: Xiaomi Mi series phone logic boards.