
A Mijing BGA reballing stencil set covering Nubia logic boards.
A Mijing BGA reballing stencil set covering Nubia logic boards. Each stencil is cut for a specific chip footprint, so the ball array lands exactly on the pads…
A Mijing BGA reballing stencil set covering Nubia logic boards. Each stencil is cut for a specific chip footprint, so the ball array lands exactly on the pads with no manual alignment.
Micro-soldering technicians doing chip-level work on Nubia boards.
Clean the old solder off the chip and level the pads, seat the chip in the stencil recess, squeegee solder paste across the openings, reflow with hot air, then lift the stencil once the balls have set.
A Mijing BGA reballing stencil set covering Nubia logic boards. Each stencil is cut for a specific chip footprint, so the ball array lands exactly on the pads with no manual alignment. • Cut to specific Nubia chip footprints — no manual ball alignment • Covers CPU and middle-layer reballing • Steel construction that stays flat under hot air Compatible with: Nubia series phone logic boards.
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