How does this differ from the DP25?

A different blade profile in the same family. Which suits you depends on the angle you work at and the chip you are clearing — many technicians keep both.

Can I use a normal craft blade instead?

You can, but a general-purpose blade skids on hard underfill, and on a logic board it skids into the components next to the chip. A purpose-ground blade parts the glue with controlled force.

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Mijing CPU QUICK-REPAIRN GLUE REMOVE KNIFE DP24

Name: Mijing CPU QUICK-REPAIRN GLUE REMOVE KNIFE DP24
Brand: Mijing
SKU: MJ-DP24
Price: 400 PKR
Availability: InStock

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A precision knife ground for removing adhesive and epoxy from CPU and motherboard surfaces.

Rs 400

A precision knife ground for removing adhesive and epoxy from CPU and motherboard surfaces. Underfill under a CPU cures very hard and bonds to the board as…

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A precision knife ground for removing adhesive and epoxy from CPU and motherboard surfaces.

Underfill under a CPU cures very hard and bonds to the board as well as the chip, so it has to be split away mechanically. A blade shaped for the job parts it with controlled force; a general-purpose blade skids, and on a board it skids into the components beside the chip.

Key features

Blade profile ground for underfill and epoxy work
Controlled force rather than skidding pressure
For CPU and motherboard surface cleaning

What this is used for

Removing underfill from around a CPU
Clearing epoxy before chip removal
Board surface cleaning

Who it's for

Micro-soldering technicians removing underfilled chips.

Manufacturer description

A precision knife ground for removing adhesive and epoxy from CPU and motherboard surfaces. Underfill under a CPU cures very hard and bonds to the board as well as the chip, so it has to be split away mechanically. A blade shaped for the job parts it with controlled force; a general-purpose blade skids, and on a board it skids into the components beside the chip. • Blade profile ground for underfill and epoxy work • Controlled force rather than skidding pressure • For CPU and motherboard surface cleaning Compatible with: Phone logic boards with underfilled CPUs and power management ICs.