Different blade profiles in the same family — the choice comes down to your working angle and the chip in front of you. Technicians who do this daily usually keep both.

Should I heat the underfill first?

Gentle warmth softens it and reduces the force needed, which is always safer. Do not overheat: too much heat reflows the joints you are trying to keep intact.

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Mijing CPU QUICK-REPAIRN GLUE REMOVE KNIFE DP25

Name: Mijing CPU QUICK-REPAIRN GLUE REMOVE KNIFE DP25
Brand: Mijing
SKU: MJ-DP25
Price: 400 PKR
Availability: InStock

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A precision knife for removing adhesive and epoxy from CPUs and motherboard components, in the DP series.

Rs 400

A precision knife for removing adhesive and epoxy from CPUs and motherboard components, in the DP series. The blade is shaped so the cutting force goes into…

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A precision knife for removing adhesive and epoxy from CPUs and motherboard components, in the DP series.

The blade is shaped so the cutting force goes into the glue rather than across the board. That is the whole safety argument for a purpose-ground tool: hardened underfill needs real force to part, and where that force goes decides whether the chip comes free or the components beside it do.

Key features

Blade profile directs force into the glue, not across the board
For CPU and IC epoxy removal
Sized for work between board components

What this is used for

Removing underfill from around a CPU
Clearing epoxy before chip removal
Board surface cleaning

Who it's for

Micro-soldering technicians removing underfilled chips.

Manufacturer description

A precision knife for removing adhesive and epoxy from CPUs and motherboard components, in the DP series. The blade is shaped so the cutting force goes into the glue rather than across the board. That is the whole safety argument for a purpose-ground tool: hardened underfill needs real force to part, and where that force goes decides whether the chip comes free or the components beside it do. • Blade profile directs force into the glue, not across the board • For CPU and IC epoxy removal • Sized for work between board components Compatible with: Phone logic boards with underfilled CPUs and power management ICs.