MIJING iRepair MS1 S22+ Heating Module
No reviews
MIJING iRepair MS1 S22+ Heating Module.
Rs 2,500
MIJING iRepair MS1 S22+ Heating Module. A model-specific heating module for the iRepair platform, shaped so the Samsung Galaxy S22 Plus board sits into it and…
Only 3 left in stock
- Nationwide deliverySame-day dispatch from Peshawar before 4 PM
- Authentic parts100% genuine, sourced from manufacturers
- 7-day returnsNo-questions return on most items
MIJING iRepair MS1 S22+ Heating Module.
A model-specific heating module for the iRepair platform, shaped so the Samsung Galaxy S22 Plus board sits into it and heats evenly from underneath.
Key features
- Shaped to the Samsung Galaxy S22 Plus board
- Even heating from underneath reduces thermal shock
- Module for the iRepair MS1 platform
What this is used for
- Preheating a board for chip removal
- Stacked-board separation and rejoining
- Reducing thermal shock during rework
Who it's for
Board-level technicians running an iRepair MS1 platform.
Manufacturer description
MIJING iRepair MS1 S22+ Heating Module. A model-specific heating module for the iRepair platform, shaped so the Samsung Galaxy S22 Plus board sits into it and heats evenly from underneath. • Shaped to the Samsung Galaxy S22 Plus board • Even heating from underneath reduces thermal shock • Module for the iRepair MS1 platform Compatible with: Samsung Galaxy S22 Plus logic board, iRepair MS1 platform.
Repair guides for this tool
You might also like
More from Heat Welding Series
Only 3 left
Only 3 left
