MIJING iRepair MS1 S25+ (plus) Module
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MIJING iRepair MS1 S25+ (plus) Module.
Rs 2,500
MIJING iRepair MS1 S25+ (plus) Module. A model-specific heating module for the iRepair platform, shaped so the Samsung Galaxy S25 Plus board sits into it and…
Only 3 left in stock
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MIJING iRepair MS1 S25+ (plus) Module.
A model-specific heating module for the iRepair platform, shaped so the Samsung Galaxy S25 Plus board sits into it and heats evenly from underneath.
Key features
- Shaped to the Samsung Galaxy S25 Plus board
- Even heating from underneath reduces thermal shock
- Module for the iRepair MS1 platform
What this is used for
- Preheating a board for chip removal
- Stacked-board separation and rejoining
- Reducing thermal shock during rework
Who it's for
Board-level technicians running an iRepair MS1 platform.
Manufacturer description
MIJING iRepair MS1 S25+ (plus) Module. A model-specific heating module for the iRepair platform, shaped so the Samsung Galaxy S25 Plus board sits into it and heats evenly from underneath. • Shaped to the Samsung Galaxy S25 Plus board • Even heating from underneath reduces thermal shock • Module for the iRepair MS1 platform Compatible with: Samsung Galaxy S25 Plus logic board, iRepair MS1 platform.
Repair guides for this tool
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