Rabbitfix UniBall Mid-Layer Solder Balls 183°C (100,000 Balls/Bottle)
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Mid-layer solder balls for BGA reballing, supplied 100,000 to a bottle — the consumable that gets used fastest on a reballing bench.
Rs 3,000
Mid-layer solder balls for BGA reballing, supplied 100,000 to a bottle — the consumable that gets used fastest on a reballing bench. The 183°C melting point is…
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Mid-layer solder balls for BGA reballing, supplied 100,000 to a bottle — the consumable that gets used fastest on a reballing bench.
The 183°C melting point is the standard leaded eutectic figure, which is what keeps reflow temperature low enough to protect the surrounding board during mid-layer work.
It comes in two variants, one tailored for Android and one for iPhone models, so check which you need before ordering.
Key features
- 183°C melting point
- 100,000 balls per bottle
- Two variants: Android and iPhone
- For mid-layer BGA reballing and rework
What this is used for
- BGA reballing
- Mid-layer chip rework
- Chip-level repair
Who it's for
Technicians doing BGA reballing and chip-level rework.
Manufacturer description
Mid-layer solder balls for BGA reballing, supplied 100,000 to a bottle — the consumable that gets used fastest on a reballing bench. The 183°C melting point is the standard leaded eutectic figure, which is what keeps reflow temperature low enough to protect the surrounding board during mid-layer work. It comes in two variants, one tailored for Android and one for iPhone models, so check which you need before ordering. • 183°C melting point • 100,000 balls per bottle • Two variants: Android and iPhone • For mid-layer BGA reballing and rework Compatible with: Android device boards, iPhone boards.
Repair guides for this tool
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