
Rabbit Fix XJ-183 Cool Paste.
Rabbit Fix XJ-183 Cool Paste. Solder paste is powdered solder suspended in flux. You squeegee it through a stencil when reballing and place it under a…
Rabbit Fix XJ-183 Cool Paste.
Solder paste is powdered solder suspended in flux. You squeegee it through a stencil when reballing and place it under a component before reflow. This one melts at 183°C.
183°C is the eutectic point of 63/37 tin-lead: the alloy goes straight from solid to liquid with no pasty stage, and that sharp transition is what gives a clean joint.
Micro-soldering technicians doing reballing and rework.
Rabbit Fix XJ-183 Cool Paste. Solder paste is powdered solder suspended in flux. You squeegee it through a stencil when reballing and place it under a component before reflow. This one melts at 183°C. 183°C is the eutectic point of 63/37 tin-lead: the alloy goes straight from solid to liquid with no pasty stage, and that sharp transition is what gives a clean joint. • 183°C melting point • Powdered solder suspended in flux • Squeegee grade for stencil work Compatible with: BGA reballing stencils and phone board rework.
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