183°C ReBoost Solventless Extract
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Silver-bearing solder paste at the 183°C eutectic point — low enough to reflow a joint without cooking the components around it.
Rs 1,400
Silver-bearing solder paste at the 183°C eutectic point — low enough to reflow a joint without cooking the components around it. The silver (Ag+) content…
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Silver-bearing solder paste at the 183°C eutectic point — low enough to reflow a joint without cooking the components around it.
The silver (Ag+) content supports strong, low-resistance joints on fine-pitch work. Supplied in a sealed jar.
What this is used for
- Micro-soldering
- Board-level rework and reballing
Who it's for
Micro-soldering technicians.
Manufacturer description
Silver-bearing solder paste at the 183°C eutectic point — low enough to reflow a joint without cooking the components around it. The silver (Ag+) content supports strong, low-resistance joints on fine-pitch work. Supplied in a sealed jar.
Repair guides
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