What is underfill and why is it hard to remove?

It is the epoxy Apple and others flow under large chips to stop the solder joints cracking. It cures very hard and bonds to the board as well as the chip, so it has to be split away mechanically rather than melted off.

Why hand-finished edges?

Because at this scale a hand-ground edge is meaningfully sharper than a machine-ground one, and sharper means less force. Less force is what keeps the components beside the chip attached to the board.

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2UUL DA11 Hand Finish SEXY Blades Set for PCB Underfill Clean

Name: 2UUL DA11 Hand Finish SEXY Blades Set for PCB Underfill Clean
Brand: 2UUL
SKU: 2UUL-DA11
Price: 2000 PKR
Availability: InStock

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A set of hand-finished blades ground specifically for splitting underfill away from logic board components.

Rs 2,000

A set of hand-finished blades ground specifically for splitting underfill away from logic board components. Hand finishing is the difference that matters here.…

Only 1 left in stock

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A set of hand-finished blades ground specifically for splitting underfill away from logic board components.

Hand finishing is the difference that matters here. A machine-ground edge is consistent but comparatively blunt at this scale; a hand-finished edge parts hardened black glue with far less force, and less force is exactly what keeps neighbouring components on the board.

Key features

Hand-ground edges for low-force glue splitting
Profiles shaped for underfill work specifically
Supplied as a set

What this is used for

Splitting underfill around a CPU
Clearing black glue before chip removal
Pad cleaning

Who it's for

Micro-soldering technicians removing underfilled chips.

Manufacturer description

A set of hand-finished blades ground specifically for splitting underfill away from logic board components. Hand finishing is the difference that matters here. A machine-ground edge is consistent but comparatively blunt at this scale; a hand-finished edge parts hardened black glue with far less force, and less force is exactly what keeps neighbouring components on the board. • Hand-ground edges for low-force glue splitting • Profiles shaped for underfill work specifically • Supplied as a set Compatible with: Phone logic boards with underfilled CPU and power management ICs.