
Five flat-profile blades per box, ground as a chisel rather than a point, for clearing glue and underfill off solder pads.
Five flat-profile blades per box, ground as a chisel rather than a point, for clearing glue and underfill off solder pads. A flat edge lying along the board is…
Five flat-profile blades per box, ground as a chisel rather than a point, for clearing glue and underfill off solder pads.
A flat edge lying along the board is the safe way to work over pads: the force goes sideways across the glue instead of down into the laminate, so you shear the residue off rather than digging at it.
Micro-soldering technicians preparing pads for a new chip.
Five flat-profile blades per box, ground as a chisel rather than a point, for clearing glue and underfill off solder pads. A flat edge lying along the board is the safe way to work over pads: the force goes sideways across the glue instead of down into the laminate, so you shear the residue off rather than digging at it. • Flat chisel profile — shears glue sideways off pads • Five blades per box • For pad preparation before reballing or chip fitting Compatible with: Phone logic board pad areas after chip removal.
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