Which chips does it cover?

The name states the coverage where the manufacturer specifies it. Tell us the exact board or chip you are reballing and we will confirm before you order.

What else do I need to reball?

Solder paste, hot air with fine airflow control, flux, wick to clean the pads first, and something to hold the chip flat. Buying the stencil alone leaves the job half equipped.

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MIJING Z21 iPhone CPU Reballing Stencil Platform

Name: MIJING Z21 iPhone CPU Reballing Stencil Platform
Brand: Mijing
SKU: MJ-Z21-CPU
Price: 6500 PKR
Availability: InStock

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MIJING Z21 iPhone CPU Reballing Stencil Platform.

Rs 6,500

MIJING Z21 iPhone CPU Reballing Stencil Platform. • Aligns the ball array to the pads in one pass • Cut for specific chip footprints • Steel construction that…

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MIJING Z21 iPhone CPU Reballing Stencil Platform.

Key features

Aligns the ball array to the pads in one pass
Cut for specific chip footprints
Steel construction that stays flat under hot air

What this is used for

Reballing a chip after removal
Rebuilding a ball array
Middle-layer and CPU reballing

Who it's for

Micro-soldering technicians reballing chips.

Where it fits in the repair

Clean the old solder off and level the pads, seat the chip, lay the stencil over it, squeegee paste across the openings, reflow, then lift the stencil once the balls have set.

Manufacturer description

MIJING Z21 iPhone CPU Reballing Stencil Platform. • Aligns the ball array to the pads in one pass • Cut for specific chip footprints • Steel construction that stays flat under hot air Compatible with: BGA reballing work — confirm the footprints covered with us before ordering.