What is a "middle layer" on a Samsung board?

Samsung flagships stack two boards face to face, joined through a ball array. That interface is the middle layer, and it has to be reballed whenever the halves are separated for repair.

Will it fit another Galaxy model?

No. It is cut for the Samsung Galaxy S23 Plus footprint specifically. A platform for a different model will not line the openings up with the pads.

Solder paste, hot air with fine airflow control, flux and desoldering wick to clean the pads first. A board this size needs even heating — rushing it warps the laminate.

DEEPFIXQuality you love

MIJING Z23 BGA Reballing Stencil Platform for Samsung Galaxy S23+ (Plus)

Name: MIJING Z23 BGA Reballing Stencil Platform for Samsung Galaxy S23+ (Plus)
Brand: Mijing
SKU: MJ-Z23-BGA
Price: 2500 PKR
Availability: InStock

No reviews

A Mijing Z23 reballing platform cut for the Samsung Galaxy S23 Plus middle layer — the interposer array that joins the stacked halves of the logic board.

Rs 2,500

A Mijing Z23 reballing platform cut for the Samsung Galaxy S23 Plus middle layer — the interposer array that joins the stacked halves of the logic board. • Cut…

Only 2 left in stock

Quantity

Not sure it fits your repair? Ask a technician

Nationwide delivery
Same-day dispatch from Peshawar before 4 PM
Authentic parts
100% genuine, sourced from manufacturers
7-day returns
No-questions return on most items

A Mijing Z23 reballing platform cut for the Samsung Galaxy S23 Plus middle layer — the interposer array that joins the stacked halves of the logic board.

Key features

Cut specifically for the Samsung Galaxy S23 Plus middle-layer footprint
Holds the board flat so the stencil sits square
Steel construction that stays flat under hot air

What this is used for

Reballing the stacked-board middle layer
Rejoining split board halves
Board-level repair on Samsung flagships

Who it's for

Micro-soldering technicians splitting and rejoining Samsung Galaxy S23 Plus boards.

Where it fits in the repair

Split the board halves, clean and level the pads, seat the lower half in the platform, lay the stencil over it, squeegee paste across the openings, reflow, then lift the stencil once the balls have set.

Manufacturer description

A Mijing Z23 reballing platform cut for the Samsung Galaxy S23 Plus middle layer — the interposer array that joins the stacked halves of the logic board. • Cut specifically for the Samsung Galaxy S23 Plus middle-layer footprint • Holds the board flat so the stencil sits square • Steel construction that stays flat under hot air Compatible with: Samsung Galaxy S23 Plus logic board.