
MIJING Z23 BGA Reballing Stencil Platform for Samsung Galaxy S25
A Mijing Z23 reballing platform cut for the Samsung Galaxy S25 middle layer — the interposer array that joins the stacked halves of the logic board.
A Mijing Z23 reballing platform cut for the Samsung Galaxy S25 middle layer — the interposer array that joins the stacked halves of the logic board. • Cut…
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A Mijing Z23 reballing platform cut for the Samsung Galaxy S25 middle layer — the interposer array that joins the stacked halves of the logic board.
Key features
- Cut specifically for the Samsung Galaxy S25 middle-layer footprint
- Holds the board flat so the stencil sits square
- Steel construction that stays flat under hot air
What this is used for
- Reballing the stacked-board middle layer
- Rejoining split board halves
- Board-level repair on Samsung flagships
Who it's for
Micro-soldering technicians splitting and rejoining Samsung Galaxy S25 boards.
Where it fits in the repair
Split the board halves, clean and level the pads, seat the lower half in the platform, lay the stencil over it, squeegee paste across the openings, reflow, then lift the stencil once the balls have set.
Manufacturer description
A Mijing Z23 reballing platform cut for the Samsung Galaxy S25 middle layer — the interposer array that joins the stacked halves of the logic board. • Cut specifically for the Samsung Galaxy S25 middle-layer footprint • Holds the board flat so the stencil sits square • Steel construction that stays flat under hot air Compatible with: Samsung Galaxy S25 logic board.
Repair guides for this tool
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