Which models does this plate fit?

The iPhone 13 Mini and iPhone 13 Pro. Other 13-series boards use the standard 13-series plate.

How does it protect the CPU?

It applies localised perimeter heating to melt the middle-frame solder without overheating the central CPU or the sensitive Face ID and baseband chips.

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WL 13mini/13Pro Series Heating Module

Name: WL 13mini/13Pro Series Heating Module
Brand: WL
Price: 10000 PKR
Availability: InStock

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A WL heating plate cut specifically for the iPhone 13 Mini and 13 Pro board perimeters, giving an exact, non-slip fit rather than a generic platform the board can shift on.

Rs 10,000

A WL heating plate cut specifically for the iPhone 13 Mini and 13 Pro board perimeters, giving an exact, non-slip fit rather than a generic platform the board…

Only 1 left in stock

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A WL heating plate cut specifically for the iPhone 13 Mini and 13 Pro board perimeters, giving an exact, non-slip fit rather than a generic platform the board can shift on.

Heating is localised to the perimeter so the middle-frame solder melts while the central CPU and the Face ID and baseband chips stay out of the heat path.

The alloy is chosen for uniform conductivity — hot spots are what warp a multi-layer board — and alignment magnets snap it onto the main station base.

Key features

Precise CNC grooves matched to the 13 Mini and 13 Pro board perimeters
Localised perimeter heating protects the CPU and Face ID / baseband chips
Uniform-conductivity premium alloy prevents hot spots and board warping
High-strength magnetic placement onto the main station base

What this is used for

Separating layered iPhone 13 Mini and 13 Pro logic boards
Middle-frame solder stratification

Who it's for

Board-level technicians separating iPhone 13 Mini and 13 Pro logic boards.

Manufacturer description

A WL heating plate cut specifically for the iPhone 13 Mini and 13 Pro board perimeters, giving an exact, non-slip fit rather than a generic platform the board can shift on. Heating is localised to the perimeter so the middle-frame solder melts while the central CPU and the Face ID and baseband chips stay out of the heat path. The alloy is chosen for uniform conductivity — hot spots are what warp a multi-layer board — and alignment magnets snap it onto the main station base. • Precise CNC grooves matched to the 13 Mini and 13 Pro board perimeters • Localised perimeter heating protects the CPU and Face ID / baseband chips • Uniform-conductivity premium alloy prevents hot spots and board warping • High-strength magnetic placement onto the main station base Compatible with: iPhone 13 Mini, iPhone 13 Pro.