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HomeShopWLWL 13/13ProMax Series Heating Module
WL 13 series CNC heating module for separating iPhone 13 logic board layers

WL 13/13ProMax Series Heating Module

No reviews

The 13-series plate in the WL platform range, CNC-machined with slots matching the contours of all four iPhone 13 logic boards.

Rs 10,000

The 13-series plate in the WL platform range, CNC-machined with slots matching the contours of all four iPhone 13 logic boards. Conduction is edge-only: heat…

Only 1 left in stock
Not sure it fits your repair? Ask a technician
  • Nationwide delivery
    Same-day dispatch from Peshawar before 4 PM
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The 13-series plate in the WL platform range, CNC-machined with slots matching the contours of all four iPhone 13 logic boards.

Conduction is edge-only: heat goes into the middle-frame solder perimeter and stays away from the tightly packed A15 Bionic CPU and the baseband ICs beside it.

A pure copper and graphite core gives it rapid heat-up and uniform dissipation across the solder joints, and alignment magnets snap it onto the WL base station.

Key features

  • CNC-machined slots for four different iPhone 13 board shapes
  • Edge-only conduction protecting the A15 Bionic CPU and baseband ICs
  • Pure copper / graphite core for rapid, uniform heating
  • Internal alignment magnets for quick swapping

What this is used for

  • Separating layered iPhone 13-series logic boards
  • Board preparation for chip-level repair

Who it's for

Board-level technicians separating iPhone 13-series logic boards.

Manufacturer description

The 13-series plate in the WL platform range, CNC-machined with slots matching the contours of all four iPhone 13 logic boards. Conduction is edge-only: heat goes into the middle-frame solder perimeter and stays away from the tightly packed A15 Bionic CPU and the baseband ICs beside it. A pure copper and graphite core gives it rapid heat-up and uniform dissipation across the solder joints, and alignment magnets snap it onto the WL base station. • CNC-machined slots for four different iPhone 13 board shapes • Edge-only conduction protecting the A15 Bionic CPU and baseband ICs • Pure copper / graphite core for rapid, uniform heating • Internal alignment magnets for quick swapping Compatible with: iPhone 13, iPhone 13 Mini, iPhone 13 Pro, iPhone 13 Pro Max.

Repair guides for this tool

  • TutorialHow to Reball a BGA Chip: Step-by-Step Guide

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