Which iPhone models does the WL 17-series heating module fit?

It seats and aligns the logic boards of the iPhone 17, iPhone 17 Air (Slim), iPhone 17 Pro and iPhone 17 Pro Max.

Will the heat damage the CPU during separation?

The module uses a hollow centre-column thermal barrier so heat is concentrated strictly along the middle-frame solder perimeter, keeping it away from the CPU and fragile ICs to avoid thermal swelling or board cracking.

How does it attach to the host station?

Underlying high-strength indexing magnets snap it directly into position on the orange WL host platform, so no screws or clamps are needed.

DEEPFIXQuality you love

WL 17 Series Heating Module

Name: WL 17 Series Heating Module
Brand: WL
Price: 22000 PKR
Availability: InStock

No reviews

Layered iPhone logic boards have to come apart before you can work on either half, and the risk in that job is heat going where it is not wanted.

Rs 22,000

Layered iPhone logic boards have to come apart before you can work on either half, and the risk in that job is heat going where it is not wanted. This WL…

Only 1 left in stock

Quantity

Not sure it fits your repair? Ask a technician

Nationwide delivery
Same-day dispatch from Peshawar before 4 PM
Authentic parts
100% genuine, sourced from manufacturers
7-day returns
No-questions return on most items

A hollow centre column acts as the thermal barrier. Keeping heat off the core means the CPU and the fragile ICs around it are not subjected to the thermal swelling or internal cracking that causes a separation job to turn into a much larger repair.

It mounts without hardware. Indexing magnets underneath snap it into position on the orange WL host platform, so there is nothing to screw down or clamp while you are working under a microscope.

Key features

CNC-machined seating for four different 17-series board shapes
Hollow centre-column barrier concentrates heat on the solder perimeter
High-strength indexing magnets — screw-free and clamp-free mounting
Even heat distribution that removes cold spots during separation

What this is used for

Separating layered iPhone 17-series logic boards
Board preparation ahead of chip-level or microsoldering work
Re-joining board layers after component repair

Who it's for

Microsoldering and board-level technicians who separate layered iPhone logic boards as part of routine chip-level repair.

Where it fits in the repair

Board removal → seat on the heating module → perimeter heating and layer separation → component repair → re-join and test.

Manufacturer description

Layered iPhone logic boards have to come apart before you can work on either half, and the risk in that job is heat going where it is not wanted. This WL platform is machined for the 17-series board shapes and concentrates thermal energy along the middle-frame solder perimeter instead of flooding the whole board. A hollow centre column acts as the thermal barrier. Keeping heat off the core means the CPU and the fragile ICs around it are not subjected to the thermal swelling or internal cracking that causes a separation job to turn into a much larger repair. It mounts without hardware. Indexing magnets underneath snap it into position on the orange WL host platform, so there is nothing to screw down or clamp while you are working under a microscope. • CNC-machined seating for four different 17-series board shapes • Hollow centre-column barrier concentrates heat on the solder perimeter • High-strength indexing magnets — screw-free and clamp-free mounting • Even heat distribution that removes cold spots during separation Compatible with: iPhone 17, iPhone 17 Air (Slim), iPhone 17 Pro, iPhone 17 Pro Max.