Which iPhone models does the WL 14-series module fit?

The iPhone 14, 14 Plus, 14 Pro and 14 Pro Max.

Does it protect the A16 Bionic CPU?

Yes. Heat is transferred exclusively along the central column rim frame, which isolates the A16 Bionic CPU and nearby baseband IC modules from overheating and thermal micro-warping.

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WL 14 Series Heating Module

Name: WL 14 Series Heating Module
Brand: WL
Price: 10000 PKR
Availability: InStock

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The 14-series plate in the WL platform range, precision-carved to hold the four different iPhone 14 motherboard form factors.

Rs 10,000

The 14-series plate in the WL platform range, precision-carved to hold the four different iPhone 14 motherboard form factors. Heat is transferred only along…

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The 14-series plate in the WL platform range, precision-carved to hold the four different iPhone 14 motherboard form factors.

Heat is transferred only along the central column rim frame. Isolating the A16 Bionic CPU and the baseband IC modules beside it is what protects them from thermal micro-warping during a separation.

Indexing magnets align it onto the main digital hot plate controller without screws or brackets, and the graphite/alloy composition keeps heating uniform enough to avoid cold spots during desoldering and reballing cycles.

Key features

4-in-1 CNC mould fitting four iPhone 14 board form factors
Perimeter-only heating that isolates the A16 Bionic CPU
Magnetic realignment channels — no screws or brackets
Uniform-heating graphite/alloy composition minimises cold spots

What this is used for

Separating layered iPhone 14-series logic boards
Desoldering and reballing cycles
Board preparation for chip-level repair

Who it's for

Board-level technicians separating iPhone 14-series logic boards.

Manufacturer description

The 14-series plate in the WL platform range, precision-carved to hold the four different iPhone 14 motherboard form factors. Heat is transferred only along the central column rim frame. Isolating the A16 Bionic CPU and the baseband IC modules beside it is what protects them from thermal micro-warping during a separation. Indexing magnets align it onto the main digital hot plate controller without screws or brackets, and the graphite/alloy composition keeps heating uniform enough to avoid cold spots during desoldering and reballing cycles. • 4-in-1 CNC mould fitting four iPhone 14 board form factors • Perimeter-only heating that isolates the A16 Bionic CPU • Magnetic realignment channels — no screws or brackets • Uniform-heating graphite/alloy composition minimises cold spots Compatible with: iPhone 14, iPhone 14 Plus, iPhone 14 Pro, iPhone 14 Pro Max.