WL 14 Series Heating Module

The 14-series plate is specifically engineered to handle the intricate internal layouts of the iPhone 14 lineup:4-in-1 CNC Component Mold: Precision-carved to simultaneously fit and securely hold the differing motherboard form factors of the iPhone 14, 14 Plus, 14 Pro, and 14 Pro Max.Perimeter-Only Heating System: Uses targeted induction to transfer heat exclusively along the central column rim frame. This configuration isolates the A16 Bionic CPU and nearby baseband IC modules from overheating, protecting them against thermal micro-warping.Magnetic Realignment Channels: Equipped with underlying indexing magnets that align the module safely onto the main digital hot plate controller without requiring physical screws or brackets.Rapid Thermal Conductivity: Manufactured using premium uniform-heating graphite/alloy compositions to minimize cold spots during solder desoldering and reballing cycles